Plating on a wafer
From prototype to mass production! We accept plating for various types of wafers!
This is an acidic copper plating used for circuit boards, silicon wafers, etc. (with gloss agent) ■ Platable wafer materials: GaAs, Si, etc. ■ Platable electrode materials: Seed layers of Cu, Au, etc. ■ Mass production wafer sizes: 3 inches, 4 inches ■ Mass production capacity: 1,000 wafers/month ■ Prototype wafer sizes: 3, 4, 8 inches ■ Types of plating: Electrodeposited copper plating, electrolytic and electroless nickel plating, electrolytic and electroless gold plating, electrolytic and electroless palladium plating, electrolytic and electroless tin plating Our achievements: Mounting components for smartphones We will provide proposals that meet your requirements. Please feel free to contact us for any inquiries, no matter how trivial.
- Company：株式会社三ツ矢
- Price：Other
